LMJ – Laser MicroJet for our patented diamonds
This is patented technology by Swiss company – Synova.
The LMJ technology is a hybrid method combining a laser with a hair-thin water jet that precisely guides the laser beam by means of total internal reflection at the water/ air interface.
The water jet cools the cut zone of the stone resulting in very smooth side wall surfaces. Compared with conventional laser methods, diamond manufacturers report that the Laser MicroJet with its inherent water cooling capability helps to reduce the damage rate in diamonds drastically, especially in tension goods.
The Laser MicroJet (LMJ) is a hybrid method of machining, which combines a laser with a “hair-thin” water jet that precisely guides the laser beam by means of total internal reflection in a manner similar to conventional optical fibers. The water jet continually cools the cutting zone and efficiently removes debris.
As a “cold, clean and controlled laser”, LMJ technology resolves the significant problems associated with dry lasers such as thermal damage, contamination, deformation, debris deposition, oxidation, micro-cracks and taper.
The LMJ technology employs a laser beam that is completely reflected at the air-water interface. The beam can be guided over a distance of up to 10 cm, enabling parallel high aspect ratio kerfs. No focusing or distance control is required.
Thanks to the water jet cooling capability there is virtually no heat damage (no HAZ) and material change. The ablated material is removed with the water flow leaving clean surfaces and neither depositions nor burrs.
The LMJ can cut a wide variety of material thicknesses – from a micron to centimeters. It can cut up to 30 mm thick diamond or silicon carbide or drill up to 15 mm thick superalloys (hole diameter 800 µm).
